Cleavage (crystal)
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Cleavage, in mineralogy, is the tendency of crystalline materials to split along definite planes, creating smooth surfaces, of which there are several named types:
- Basal cleavage: cleavage parallel to the base of a crystal, or to the plane of the lateral axes. This occurs quite easily in graphite, making the material feel slippery.
- Cubic cleavage: cleavage parallel to the faces of a cube. This is the source of the cubic shape seen in crystals of ground table salt (sodium chloride).
- Diagonal cleavage: cleavage parallel to a diagonal plane.
- Lateral cleavage: cleavage parallel to the lateral planes.
- Octahedral, Dodecahedral, or Rhombohedral cleavage: cleavage parallel to the faces of an octahedron, dodecahedron, or rhombohedron (respectively). Octahedral cleavage is seen in common semiconductors (see below).
This is of technical importance in the electronics industry and in the cutting of gemstones. While precious stones are generally cleaved by impact, man-made single crystals of semiconductor materials are generally sold as thin wafers which are much easier to cleave. Simply pressing a silicon wafer against a soft surface and scratching its edge with a diamond scribe is usually enough to cause cleavage; however, when dicing a wafer to form chips, a procedure of scoring and breaking is often followed for greater control. Elemental semiconductors (Si, Ge, and diamond) are diamond cubic, a space group for which octahedral cleavage is observed. This means that some orientations of wafer allow near-perfect rectangles to be cleaved. Most other commercial semiconductors (GaAs, InSb, etc.) can be made in the related zinc blende structure, with similar cleavage planes.
[edit] References
- Hurlbut, Cornelius S.; Klein, Cornelis, 1985, Manual of Mineralogy, 20th ed., Wiley, pp. 200 - 202, ISBN 0-471-80580-7
- Mineral galleries: Mineral properties - Cleavage
