Flip chip
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A flip chip is one type of mounting used for semiconductor devices, such as IC chips, which does not require any wire bonds. Instead the final wafer processing step deposits solder bumps[disambiguation needed] on the chip pads. After cutting the wafer into individual dice, the "flip chip" is then mounted upside down in/on the package and the solder reflowed. Flip chips then normally will undergo an underfill process which will cover the sides of the die, similar to the encapsulation process. The terminology flip chip originates from the upside down (i.e. flipped) mounting of the die. This leaves the chip pads and their solder beads facing down onto the package, while the back side of the die faces up. This mounting is also known as the Controlled Collapse Chip Connection, or C4.
Flip chip assembly has long been used in the automotive industry, and is now gaining popularity among manufacturers of cell phones, pagers and microprocessors. Flip chip assembly provides an advantage in size, cost and performance.
