High Power Impulse Magnetron Sputtering
From Wikipedia, the free encyclopedia
High Power Impulse Magnetron Sputtering (HIPIMS)
also known as High Impact Power Magnetron Sputtering and High Power Pulsed Magnetron Sputtering
HIPIMS is a method for physical vapor deposition of thin films which is based on magnetron sputter deposition. HIPIMS utilises extremely high power densities of the order of kWcm-2 in short pulses (impulses) of tens of microseconds at low duty cycle (on/off time ratio) of < 10%.
HIPIMS is used for:
- adhesion enhancing pretreatment of the substrate prior to coating deposition (substrate etching)
- thin film deposition
Contents |
[edit] HIPIMS Plasma Discharge
HIPIMS plasma is generated by a glow discharge where the discharge current density can reach up to 6 Acm-2, whilst the discharge voltage is maintained at several hundred volts[1]. The discharge is homogeneously distributed across the surface of the cathode of the chamber. HIPIMS generates a high density plasma of the order of 1013 ions cm-3 [1] containing high fractions of target metal ions.
[edit] Substrate pretreatement by HIPIMS
Substrate pretreatment in a plasma environment is required prior to deposition of thin films on mechanical components such as automotive parts, metal cutting tools and decorative fittings. The substrates are immersed in a plasma and biased to a high voltage of a few hundred volts. This causes high energy ion bombardment that sputters away any contamination. In cases when the plasma contains metal ions, they can be implanted into the substrate to a depth of a few nm. HIPIMS is used to generate a plasma with a high density and high proportion of metal ions. When looking at the film-substrate interface in cross-section, one can see a clean interface. Epitaxy or atomic registry is typical between the crystal of a nitride film and the crystal of a metal substrate[2]. HIPIMS has been used for the pretreatment of steel substrates for the first time in February 2001 by A.P. Ehiasarian.[3]
[edit] Thin Film Deposition by HIPIMS
Thin films deposited by HIPIMS at discharge current density > 0.5 Acm-2 have a dense columnar structure with no voids. Copper films deposited by HIPIMS are able to fill high aspect ratio trenches
HIPIMS has been used for the deposition of transition metal nitride (CrN) thin films for the first time in February 2001 by A.P. Ehiasarian. The films had a dense microstructure, were free of large scale defects and had low sliding wear coefficient[3].
[edit] External Links
http://materials.shu.ac.uk/ncpvd
[edit] References
- ^ a b Ehiasarian, Arutiun P.; R. New & W.-D. Munz et al. (2002), "Influence of High Power Densities on the Composition of Pulsed Magnetron Plasmas", Vacuum 65: 147-154.
- ^ Ehiasarian, Arutiun P.; J.G. Wen & I. Petrov (2007), "High Power Pulsed Magnetron Sputtered CrNx Films", Journal of Applied Physics 101: 054301.
- ^ a b Ehiasarian, Arutiun P.; W.-D. Munz & L. Hultman et al. (2003), "High Power Pulsed Magnetron Sputtered CrNx Films", Surface and Coatings Technology 163-164: 267.
--Arutiun 21:23, 8 April 2007 (UTC)
